Aluminum Base Copper Clad Laminate PCB Raw Material Double Layer Copper Clad Laminate Sheet
Aluminum Base Copper Clad Laminate PCB Raw Material Double Layer Copper Clad Laminate Sheet Specification: More Differen
Description
Basic Info
Standard | GB/T |
Sheet Type | Insulation Sheet |
All Material | Aluminum+PP+Copper Foil |
Rated Voltage | 1kv |
Tensile Strength | Excellent, Excellent |
Product Name | Aluminum Based Copper Clad Laminate |
Plate Thickness | 0.4,0.6,0.8,1.0,1.2,1.6,2.0,3.0mm |
Copper Thickness | 15,18,25,35,70um |
Thermal Conductivity | 0.8W,1.0W,1.5W,2.0W,3.0W,5.0W,8.0W |
Size | 1000*1200mm or Customized |
Usage | for LED Light |
Transport Package | Standard Export Package |
Specification | 15, 18, 25, 35, 70UM |
Trademark | SCT |
Origin | Shaanxi Province |
Production Capacity | 500 Sheet/Sheets Per Day |
Product Description
Aluminum Base Copper Clad Laminate PCB Raw Material Double Layer Copper Clad Laminate Sheet Specification:Item | Unit | Test Condition | Insulation thickness 3mil(75um) | Insulation thickness 4.5mil(115um) |
Copper thickness | OZ | 1~2oz | ||
Aluminum thickness | mm | 0.8/ 1.0/1.2/ 1.6/ 2.0/3.0 | ||
Standard size | mm | 500x1200 / 600x1000 / 500x600 / 1000*1200 | ||
Peeling strength | N/mm | IPC TM-650 2.4.9 | 1.8 | 1.8 |
Thermal Stress | 288ºC/60secX5 | IPC TM-650 2.4.13 | ok | ok |
Thermal resistance | ºC/W | ASTM 5470-D | 0.65 | 0.65 |
Heat transfer | W/m.k | ASTM 5470-D | 1.5 | 1.5 |
Chemical Resistance | -- | IPC TM-650 2.3.2 | ok | ok |
Surface resistance | ohm | C-96/35/90 | 108 | 108 |
Volume resistance | Ohm.cm | C-96/35/90 | 108 | 108 |
Breakdown Voltage | kv | IPC TM-650 2.5.6 | ≥3 | ≥5 |
Dissipation Factor 1kHz Normal status 1MHz Normal status | C-96/35/90 | 4.8 4.6 | 4.8 4.6 | |
Water absorption | % | D-24/23 | ≤0.05 | ≤0.05 |
Comparative tracking index | V | IEC60112 | 600 | 600 |
Flame resistance | -- | UL94 | V0 | V0 |
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